UltraFusion

UltraFusion is an interconnect technology marketed by Apple for their M1 Ultra system on a chip (SoC).

Announcement
On March 8, 2022, Apple senior VP of hardware technologies Johny Srouji revealed that the M1 Max included a previously undisclosed feature called UltraFusion, which allowed two of the s to be packaged together to create the M1 Ultra, with twice the computing power. The silicon, fabricated by TSMC, is stated to be able to handle over 10,000 low-latency signals for an interprocessor bandwidth of 2.5 TB per second.