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The Apple M1 Max is an ARM-based system on a chip (SoC) designed by Apple. Developed for the Mac line of computers, the M1 Max and the smaller M1 Pro were introduced by Apple during a special event on October 18, 2021 for the 14 and 16-inch MacBook Pros.[1] In March 2022, it also became an option for the base configuration of the Mac Studio.[2]

Specifications[]

The M1 Max is manufactured by TSMC to Apple's design specifications. The 432 mm2 die contains 57 billion transistors that are fabricated through a 5 nm process. Dynamic RAM (DRAM) is built onto the package and is shared with memory bandwidth of up to 400GB/s through Apple's unified memory architecture (UMA) to eliminate the need to copy data from the CPU to GPU, which are both part of the package.[3][4]

The 10-core CPU (same as in the M1 Pro) contains eight high-performance cores and two high-efficiency cores, similiar to the ARM big.LITTLE architecture used by mobile devices for power efficiency. However, the GPU contains 32 cores for graphics. In some mid-level configurations, eight of the GPU cores are deactivated, indicating the practice of binning.[5] The Neural Engine contains 16 cores for machine learning performance. The Media Engine accelerates codec processing at low power with twice the performance of the M1 Pro. A Thunderbolt 4 and USB4 controller is included on the chip. It also includes its own Secure Enclave.[3]

Performance and compatibility[]

Apple M1 Ultra family

Apple advertises up to 70% faster CPU performance than the preceding M1 and quadruple the GPU performance.[3] Compatibility with Intel software is provided through Rosetta 2 emulation, with a reported performance hit of about 21-22%, but still exceeding the speed of Apple's Intel-based models.[6][7] The first operating system from Apple to support the M1 Max and M1 Pro is macOS Monterey, which can also natively run iPadOS applications on the M1 processor family.[3]

Limitations[]

DRAM must be ordered in advance in 32 or 64 GB configurations as they are part of the M1 Max's SoC package.[3][5]

UltraFusion[]

On March 8, 2022, Apple senior VP of hardware technologies Johny Srouji revealed that the M1 Max included a previously undisclosed interconnect feature called UltraFusion, which allowed two of them to be packaged together to create the Apple M1 Ultra, with twice the computing power.[8][9]

References[]

External links[]

Articles[]

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Apple Silicon
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R series : R1
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T series : T1 | T2
W / H series : W1 · H1 | W2 | W3
U series : U1
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