Marketing image of an UltraFusion interconnection.
UltraFusion is an interconnect technology marketed by Apple for their M1 Ultra system on a chip (SoC).
Announcement[]
On March 8, 2022, Apple senior VP of hardware technologies Johny Srouji revealed that the M1 Max included a previously undisclosed feature called UltraFusion, which allowed two of the dies to be packaged together to create the M1 Ultra, with twice the computing power.[1] The silicon interposer, fabricated by TSMC, is stated to be able to handle over 10,000 low-latency signals for an interprocessor bandwidth of 2.5 TB per second.[2]
References[]
- ↑ Apple Event — March 8 by Apple, YouTube. 2022-03-08.
- ↑ Apple unveils M1 Ultra, the world’s most powerful chip for a personal computer, Apple Inc. 2022-03-08.
See also[]
- Infinity Fabric Link, developed by AMD for interconnecting supported Radeon MPX modules.
External links[]
- What is UltraFusion? Apple M1 Ultra secret feature explained by Chris Smith at Trusted Reviews (2022-03-08)
