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Marketing image of an UltraFusion interconnection.

UltraFusion is an interconnect technology marketed by Apple for their M1 Ultra system on a chip (SoC).

Announcement

On March 8, 2022, Apple senior VP of hardware technologies Johny Srouji revealed that the M1 Max included a previously undisclosed feature called UltraFusion, which allowed two of the dies to be packaged together to create the M1 Ultra, with twice the computing power.[1] The silicon interposer, fabricated by TSMC, is stated to be able to handle over 10,000 low-latency signals for an interprocessor bandwidth of 2.5 TB per second.[2]

References

See also

External links

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